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DWFritz Automation understands the issues associated with wafer handling, such as controlling torque, tension, and alignment. We have completed many projects where web handling is an integral part of the project.
Apply Laminate Quickly With No Bubbles, Full Process Control Via User Recipes, And No Changeover For Different Thicknesses.
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Achieve Precise ± 0.5°C Thermal Uniformity and ± 1 psi Pressure Control With This Fully Automated Thermal Bonding System.
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Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.
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