Wafer Handling Tools

DWFritz Automation has extensive experience in integrating off-the-shelf robots and designing custom robotics for handling wafers during various processes. The robots are usually equipped with either custom edge-gripping end effectors or standard vacuum wand devices. We also have experience with Bernoulli vacuum end effectors. Our applications frequently include pre-aligners, laser mapping, and vision systems for optical character recognition (OCR).

DWFritz has successfully designed and built many tools that require specific wafer-handling capabilities to protect the wafer while still maximizing production speed. Special capabilities may be required for MEMS, photovoltaic (PV) solar cell, LED, and other applications. Our team works with technology leaders handling the largest wafer sizes and a variety of compositions.

DWFritz Automation provides a class 10,000 clean room in our facility and regularly builds machines to class 10 requirements.

Some DWFritz Automation Wafer Handling Applications

Semiconductor Industry
MEMS Industry
Photovoltaic (PV) / Solar Industry

Featured Projects

Custom Wafer Laminator

Apply Laminate Quickly With No Bubbles, Full Process Control Via User Recipes, And No Changeover For Different Thicknesses.
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Related Projects

The Class 10 Wafer Autoloader: The Class 10 Wafer Autoloader tool accepts 150mm, 200mm, or 300mm wafers, and uses an ISEL three axis robot to load a client-provided wafer inspection tool. Wafers enter the system via an operator-loaded wafer cassette. The cassette is automatically detected, and then scanned for contents and cross-slotted wafers.
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Wafer Sorting Platform: Machine receives processed wafers via conveyor and uses machine vision to read wafer ID’s. Using custom software to determine location, a Brooks-PRI® robot sorts the wafers into one of 10 cassettes.
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High Pressure Thermal Bonding System: Achieve Precise ± 0.5°C Thermal Uniformity and ± 1 psi Pressure Control With This Fully Automated Thermal Bonding System.
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local navigation for Technologies And Capabilities: 3-D Metrology; Automated Assembly; Automated Sorting; 2-sided wafer inspection; Automated Storage and Retrieval Systems; CE, UL & CSA Certifications; Clean Room Machines; Cryogenic Liquids; Custom Graphical User Interface; Inspection and Quality Assurance Machines; Integrated Motion Control; Lamination and Bonding; Laser Technology; Loading and Unloading Machines; Machine Vision; Metrology; Part Transfer Equipment; PC Controls; Pick and Place Handling; PLC Controls; Precision Dispensing; Precision Positioning and Alignment; Robotics; SECS-GEM Compliance; Sub-Micron and Nanometer Repeatability; Ultra Thin Parts Handling; Wafer Attach; Wafer Handling Tools; Web Handling Machines; Wet and Corrosive Processes

Evaluate My Project

Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.