Wafer Attach

DWFritz Automation has developed numerous tools for bonding or attaching components and materials to wafers, die and substrates with very high precision and high throughput. Components and materials include orifice plates, MEMS components, flex circuits, laminate materials, Radio Frequency Identification Devices (RFID), flip chip, LED, LCD, and integrated circuits (IC).

Featured Projects

Ultra High Precision Wafer Attach Machine

This system precisely excises small plastic parts from supply reels and attaches them to silicon wafers using a UV curable adhesive. High-performance machine vision and precision motion components enable ultra-precision alignments between the parts and wafer. A robot with a dual wafer gripper automatically moves wafers between the processing table, input cassette, and a UV flood station.
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Ultra High Precision Wafer Attach Machine

This machine attaches small, thin components to the surface of a wafer using vision-guided servo control. First, an array of parts is robotically loaded into one end of the machine. The vision system then directs the X-Y-Theta table to present an individual part for pickup. The part is then placed onto an air conveyor for transport to the attach station.
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Related Projects

Precision Adhesive Dispensing Machine: Apply Three (3) Micro-Dots Per Second With 25-Micron Accuracy.
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High Pressure Thermal Bonding System: Achieve Precise ± 0.5°C Thermal Uniformity and ± 1 psi Pressure Control With This Fully Automated Thermal Bonding System.
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local navigation for Technologies And Capabilities: 3-D Metrology; Automated Assembly; Automated Sorting; 2-sided wafer inspection; Automated Storage and Retrieval Systems; CE, UL & CSA Certifications; Clean Room Machines; Custom Graphical User Interface; Inspection and Quality Assurance Machines; Integrated Motion Control; Lamination and Bonding; Laser Technology; Loading and Unloading Machines; Machine Vision; Metrology; Part Transfer Equipment; PC Controls; Pick and Place Handling; PLC Controls; Precision Dispensing; Precision Positioning and Alignment; Robotics; SECS-GEM Compliance; Sub-Micron and Nanometer Repeatability; Ultra Thin Parts Handling; Wafer Attach; Wafer Handling Tools; Web Handling Machines; Wet and Corrosive Processes

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Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.