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Ultra Thin Parts Handling

Ultra-thin parts demand special treatment to prevent damage when they are being handled, assembled, or inspected. DWFritz has experience handling these types of items, such as MEMS components and silicon wafers used in photovoltaic (PV) solar cells.

Featured Projects

Ultra High Precision Wafer Attach Machine

Ultra High Precision Wafer Attach Machine

This machine attaches small, thin components to the surface of a wafer using vision-guided servo control. First, an array of parts is robotically loaded into one end of the machine. The vision system then directs the X-Y-Theta table to present an individual part for pickup. The part is then placed onto an air conveyor for transport to the attach station.
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Automated Cleaning and Mounting Machine

Automated Cleaning and Mounting Machine

We are saving our client over $1 million per year with this innovative system that eliminates expensive consumable materials.
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Related Projects

  • Exise and Attach Machine: This system precisely excises small plastic parts from supply reels and attaches them to silicon wafers using a UV curable adhesive. High-performance machine vision and precision motion components enable ultra-precision alignments between the parts and wafer. A robot with a dual wafer gripper automatically moves wafers between the processing table, input cassette, and a UV flood station.
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3-D Metrology
Automated Assembly
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2-sided wafer inspection
Automated Storage and Retrieval Systems
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Clean Room Machines
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Sub-Micron and Nanometer Repeatability
Ultra Thin Parts Handling
Wafer Attach
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Evaluate My Project

Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.