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DWFritz machines perform micron and sub-micron precision alignments and attachments not once or twice, but over a million times every day. If we can do this, can’t we solve your challenge, too?
Precision positioning is incorporated into many automation systems designed and built by DWFritz Automation. Machines capable of part placements with mean alignments below 1 micron and dispensing of liquids with precisions of ± 25 microns are developed using computationally extensive methods, combining machine vision and servo control. High precision stages, hexapods, robots, and other technologies are used to achieve high precision positioning.
This system precisely excises small plastic parts from supply reels and attaches them to silicon wafers using a UV curable adhesive. High-performance machine vision and precision motion components enable ultra-precision alignments between the parts and wafer. A robot with a dual wafer gripper automatically moves wafers between the processing table, input cassette, and a UV flood station.
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This machine attaches small, thin components to the surface of a wafer using vision-guided servo control. First, an array of parts is robotically loaded into one end of the machine. The vision system then directs the X-Y-Theta table to present an individual part for pickup. The part is then placed onto an air conveyor for transport to the attach station.
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Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.
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