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DWFritz’s custom lamination systems improve quality and process control, and increase throughput of your lamination and bonding processes for wafers, MEMS, MEAs, circuits, RFID Tags and other applications.
Our systems provide precise control of pressure, temperature, and time. Advanced systems also provide very low temperature variation across the press surface, less than 2 degrees Celsius.
Both compression bonding and thermal bonding technologies are utilized.
Attaches and bonds a flex circuit to a substrate with 6 micron accuracy. Also processes different products simultaneously.
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Apply Laminate Quickly With No Bubbles, Full Process Control Via User Recipes, And No Changeover For Different Thicknesses.
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Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.
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