[advance to content]

[advance to local navigation for Technologies And Capabilities]

Client log in |

Lamination and Bonding

DWFritz’s custom lamination systems improve quality and process control, and increase throughput of your  lamination and bonding processes for wafers, MEMS, MEAs, circuits, RFID Tags and other applications.

Our systems provide precise control of pressure, temperature, and time.  Advanced systems also provide very low temperature variation across the press surface, less than 2 degrees Celsius.

Both compression bonding and thermal bonding technologies are utilized.

Featured Projects

Automated Inspection and Bonding System

Automated Flex Circuit Bonding and Inspection System

Attaches and bonds a flex circuit to a substrate with 6 micron accuracy. Also processes different products simultaneously.
View project…

Custom Wafer Laminator

Custom Wafer Laminator

Apply Laminate Quickly With No Bubbles, Full Process Control Via User Recipes, And No Changeover For Different Thicknesses.
View project…

Related Projects

  • High Pressure Thermal Bonding System: Achieve Precise ± 0.5°C Thermal Uniformity and ± 1 psi Pressure Control With This Fully Automated Thermal Bonding System.
    View project…
  • Wafer Laminating Machine: 2nd generation machine processes 6-inch wafers using proprietary production methods. Uses combination of off-the-shelf robots, machine vision, and custom designed components, along with custom software, to manage cassettes of wafers through asynchronous lamination process.
    View project…
local navigation for Technologies And Capabilities
3-D Metrology
Automated Assembly
Automated Sorting
2-sided wafer inspection
Automated Storage and Retrieval Systems
CE, UL & CSA Certifications
Clean Room Machines
Custom Graphical User Interface
Inspection and Quality Assurance Machines
Integrated Motion Control
Lamination and Bonding
Laser Technology
Loading and Unloading Machines
Machine Vision
Metrology
Part Transfer Equipment
PC Controls
Pick and Place Handling
PLC Controls
Precision Dispensing
Precision Positioning and Alignment
Robotics
SECS-GEM Compliance
Sub-Micron and Nanometer Repeatability
Ultra Thin Parts Handling
Wafer Attach
Wafer Handling Tools
Web Handling Machines
Wet and Corrosive Processes

Evaluate My Project

Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.