Clean Room Machines

DWFritz Automation builds machines that are designed to fit their environment. We have equipment in various levels of clean rooms (Class 10 to Class 10,000) for semiconductor, MEMS, and medical device manufacturing. When needed, we have created mini-environments to separate processes from their surroundings.

DWFritz has over 500 square feet of Class 10,000 clean room space available to build and test systems destined for a clean room environment. We also provide diagnostic repair, refurbishment, rebuild, and first-article build of clean room equipment and sub-assemblies for our clients.

Featured Projects

Custom Wafer Laminator

Apply Laminate Quickly With No Bubbles, Full Process Control Via User Recipes, And No Changeover For Different Thicknesses.
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Automated Flex Circuit Bonding and Inspection System

Attaches and bonds a flex circuit to a substrate with 6 micron accuracy. Also processes different products simultaneously.
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Related Projects

High Pressure Thermal Bonding System: Achieve Precise ± 0.5°C Thermal Uniformity and ± 1 psi Pressure Control With This Fully Automated Thermal Bonding System.
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Thin Film Trimmer: Wafers are handled one at a time from the cassette I/O station (far right). Each wafer is placed under the optics box (top) and engaged against probe pins. A tightly focused laser beam removes material from the wafer until the appropriate circuit parameters are achieved as determined by the tester (not shown).
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Class 10 Wafer Autoloader: The Class 10 Wafer Autoloader tool accepts 150mm, 200mm, or 300mm wafers, and uses an ISEL three axis robot to load a client-provided wafer inspection tool.
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Wafer Laminating Machine: 2nd generation machine processes 6-inch wafers using proprietary production methods. Uses combination of off-the-shelf robots, machine vision, and custom designed components, along with custom software, to manage cassettes of wafers through asynchronous lamination process. After processing, wafers are sorted by individual wafer ID’s to 10 different cassettes.
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local navigation for Technologies And Capabilities: 3-D Metrology; Automated Assembly; Automated Sorting; 2-sided wafer inspection; Automated Storage and Retrieval Systems; CE, UL & CSA Certifications; Clean Room Machines; Custom Graphical User Interface; Inspection and Quality Assurance Machines; Integrated Motion Control; Lamination and Bonding; Laser Technology; Loading and Unloading Machines; Machine Vision; Metrology; Part Transfer Equipment; PC Controls; Pick and Place Handling; PLC Controls; Precision Dispensing; Precision Positioning and Alignment; Robotics; SECS-GEM Compliance; Sub-Micron and Nanometer Repeatability; Ultra Thin Parts Handling; Wafer Attach; Wafer Handling Tools; Web Handling Machines; Wet and Corrosive Processes

Evaluate My Project

Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.