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Semiconductor Manufacturing Tools

DWFritz designs and builds custom tools for the semiconductor industry, for applications such as bonding, laminating, handling wafers, performing inspections and metrology, sorting, loading and unloading, laser trimming, and more.

DWFritz Automation provides a Class 10,000 clean room in our facility and regularly builds machines to Class 10 requirements.

Featured Projects

Thin-Film Trimmer

Thin-Film Trimmer

Wafers are handled one at a time from the cassette I/O station (far right). Each wafer is placed under the optics box (top) and engaged against probe pins. A tightly focused laser beam removes material from the wafer until the appropriate circuit parameters are achieved as determined by the tester (not shown).
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Custom Wafer Laminator

Custom Wafer Laminator

Apply Laminate Quickly With No Bubbles, Full Process Control Via User Recipes, And No Changeover For Different Thicknesses.
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Related Projects

  • The Class 10 Wafer Autoloader: The Class 10 Wafer Autoloader tool accepts 150mm, 200mm, or 300mm wafers, and uses an ISEL three axis robot to load a client-provided wafer inspection tool. Wafers enter the system via an operator-loaded wafer cassette. The cassette is automatically detected, and then scanned for contents and cross-slotted wafers.
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  • ASML Autoloader: Near-Zero Maintenance Tool Solves Ergonomic Problems and Reduces Waste.
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Evaluate My Project

Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.