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DWFritz designs and builds custom tools for the semiconductor industry, for applications such as bonding, laminating, handling wafers, performing inspections and metrology, sorting, loading and unloading, laser trimming, and more.
DWFritz Automation provides a Class 10,000 clean room in our facility and regularly builds machines to Class 10 requirements.
Wafers are handled one at a time from the cassette I/O station (far right). Each wafer is placed under the optics box (top) and engaged against probe pins. A tightly focused laser beam removes material from the wafer until the appropriate circuit parameters are achieved as determined by the tester (not shown).
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Apply Laminate Quickly With No Bubbles, Full Process Control Via User Recipes, And No Changeover For Different Thicknesses.
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Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.
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