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High Precision Automation For MEMS Manufacturing

DWFritz develops custom automation assembly, inspection, and metrology equipment for MEMS (Micro Electromechanical Systems) industry applications that reduce manpower, speed throughput, and improve quality. DWFritz excels as an Engineered-To-Order design and build firm for the micron-level precision often required for MEMS manufacturing.

Over 100 Systems Built For The MEMS Industry

We have designed and built more than 100 sophisticated, custom turnkey automation systems for MEMS assembly, inspection, and metrology applications. Our MEMS clients will tell you that our solutions are simple, elegant, and they work. We know the technology, what works, and how to use it. We routinely take proven engineering technologies and apply them in creative ways to solve our clients’ most difficult MEMS challenges.

Potential DWFritz Automation MEMS industry applications:

Featured Projects

Ultra Precision Excise and Attach Machine

Ultra Precision Excise and Attach Machine

This system precisely excises small plastic parts from supply reels and attaches them to silicon wafers using a UV curable adhesive. High-performance machine vision and precision motion components enable ultra-precision alignments between the parts and wafer. A robot with a dual wafer gripper automatically moves wafers between the processing table, input cassette, and a UV flood station.
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Automated Wafer Metrology Tool

Automated Wafer Metrology Tool

This sophisticated, flexible wafer metrology system combines a Micro-Epsilon profilometer with a high-performance, high-resolution vision system and laser interferometer to detect and measure laser-cut features on both sides of either glass or silicon wafers.
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Related Projects

  • Automated Flex Circuit Bonding and Inspection System: Attaches and bonds a flex circuit to a substrate with 6 micron accuracy. Also processes different products simultaneously.
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  • Precision Part Inspection System: 0.2-Micron Fixture Repeatability Provides Ability To Take 500 Measurements Across 9 Process Steps.
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  • Ultra High Precision Wafer Attach Machine: This machine attaches small, thin components to the surface of a wafer using vision-guided servo control. First, an array of parts is robotically loaded into one end of the machine. The vision system then directs the X-Y-Theta table to present an individual part for pickup. The part is then placed onto an air conveyor for transport to the attach station.
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Evaluate My Project

Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.