Wafer Laminating Machine

2nd generation machine processes 6-inch wafers using proprietary production methods. Uses combination of off-the-shelf robots, machine vision, and custom designed components, along with custom software, to manage cassettes of wafers through asynchronous lamination process. After processing, wafers are sorted by individual wafer ID’s to 10 different cassettes.

Technical Specifications

Component	Specifications
HANDLING ROBOT:	Brooks-PRI® robot on a 14-foot linear motor track.
SORTING ROBOT:	Brooks-PRI®.
CONTROL SYSTEM:	Custom designed, Windows 2000®-based control system with real-time kernal.
OPERATOR INTERFACE:	Custom GUI (graphical user interface) in C .
MACHINE VISION:	Cognex® PC-based OCR in two locations.
WAFER TRACKING:	Custom software.
SERVO CONTROL:	Brooks-PRI® controller plus three Animatics® Smart Motors.
ENVIRONMENT:	Class 10,000 clean room.
ETHERNET DISTRIBUTED I/O:	488 points.
THROUGHPUT:	Process specific.
STORAGE CAPACITY:	Eight 25-wafer cassettes (6-inch wafers).
KEY ATTRIBUTES:	Complete wafer tracking throughout process. Verification that wafers have been processed correctly. Uses two servo-driven wafer flat finders. 6-inch wafers shown, but can be customized to other sizes. Uses sensors to verify wafer location and protect wafers. Light curtain perimeter guarding. Custom display shows number of wafers in each cassette and their ID numbers if known. Complete real-time process verification.
INTEGRATED TECHNICAL CAPABILITIES:	Wafer Handling Integrated Motion Control PC Controls Machine Vision – High Performance and Low Cost Clean Room Machines Custom Graphical User Interface (GUI)

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