Ultra High Precision Wafer Attach Machine

Attach 50-μm thin foil part with 0.8-μm accuracy @ 1.25 seconds/part.

This machine attaches small, thin components to the surface of a wafer using vision-guided servo control. First, an array of parts is robotically loaded into one end of the machine. The vision system then directs the X-Y-Theta table to present an individual part for pickup. The part is then placed onto an air conveyor for transport to the attach station. After the wafer is aligned, the part is picked up from the end of the conveyor and placed on the wafer to within one micron using another vision-guided X-Y-Theta table. Prior to placement, two dots of adhesive are placed on the wafer using another vision-guided system.

Technical Specifications

Component	Specifications
HARDWARE:	Uses 2 robots, a high performance stack of stages (X, Y, Theta), 4 vision cameras, 2 vision boards, and 2 Pentium PC’s. The system is built on a granite base with a separate granite bridge to support the optics and minimize vibration.
WAFER TRACKING:	System tracks every wafer and component (over 300 placements per wafer). Also provides process feedback and mapping for every component.
WAFER HANDLING ROBOT:	Brooks PRI robot specified by client, but we have experience with many other wafer handling robots. Custom dual end-effectors ensure rapid wafer changeout.
CONTROL SYSTEM:	Two Windows 2000 workstations with RTX real time extension; custom control program in C .
SERVO CONTROL:	Galil®. 14 axes of servo motion.
ENVIRONMENT:	Operated in Class 10,000 clean room, but interior meets Class 10 guidelines.
DISCRETE I/O:	288 I/O points.
MATERIAL HANDLING:	Custom designed and patent pending conveyor handles parts from part array to attach area. We can design other options depending on the part and the process.
THROUGHPUT:	One part attached every 1.25 seconds.
MACHINE VISION SYSTEM:	Three high performance, high resolution Cognex® cameras and two vision boards, integrated with custom, high performance Melles Griot optics. Two other OCR cameras for wafer identification.
ACCURACY:	Less than 1 micron mean alignment error.
QUALITY:	99.9% good parts.
ADHESIVE DISPENSING:	System dispenses extremely small (250 micron diameter) dots of adhesive onto wafer prior to component being attached.
USER INTERFACE:	Custom GUI in C . Developed with client to meet all the needs of the process, as well as the operators.
ITEM OF NOTE:	Each placement is inspected as it is accomplished and the data is logged to a file. Each wafer is completely mapped so errors can be flagged for downstream processes.
KEY ATTRIBUTES:	Each placement is inspected as it is accomplished and the process data is logged to a file. Each wafer is completely mapped so errors can be flagged for downstream processes. Machine communicates with client system to track bad parts from previous processes as well. Can be customized for individual product types. Designed to allow quick change-over between different product types. High accuracy, high speed, vision directed part placement and adhesive dispensing. Live video feed of alignment and placement. Operators load cassettes of wafers at one end of machine while loading canisters of part arrays at the other. The machine does the rest. During operation, canisters and cassettes can be safely changed without stopping the attach process.
INTEGRATED TECHNICAL CAPABILITIES:	Wafer Handling Integrated Motion Control Precision Dispensing Precision Positioning and Alignment PC Controls Clean Room Machines Custom Graphical User Interface (GUI)

local navigation for Featured Projects: Ultra Precision Excise and Attach Machine; Six-Axis Automated Inspection System; Ultra High Precision Wafer Attach Machine; Automated Wafer Metrology Tool; Automated Flex Circuit Bonding and Inspection System; Precision Part Inspection; High Speed Syringe Assembly; High Pressure Thermal Bonding System; High Speed Connector Assembly Machine; Laser Marking and Assembly System; Laser Assembly System; Precision Adhesive Dispensing Machine; Ultra-Sensitive Pressure and Flow Testing Machine; Robotic Material Handling System; Solar Ingot Inspection Tool; Thin Film Trimmer; Wafer Laminating Machine; Custom Wafer Laminator; Automated Wafer Inspection; Automated Cleaning and Mounting Machine; Automated Anodizing Tool; Industrial Robotic Arm; MEA Assembly System; Wafer Sorting Platform; Puzzle Master Demonstration; Bottle Inspection System

Evaluate My Project

Contact DWFritz Automation through this website or telephone us at (503) 598-9393 to get a free evaluation of your project. We’ll review your automation needs and provide an analysis of your requirements. Get in touch.