Thin-Film Trimmer

Wafers are handled one at a time from the cassette I/O station (far right). Each wafer is placed under the optics box (top) and engaged against probe pins. A tightly focused laser beam removes material from the wafer until the appropriate circuit parameters are achieved as determined by the tester (not shown). The prober steps to the next die and the laser trim process is repeated until the wafer is completed. Focus and beam position feedback is obtained optically via die registration features. The optics box lifts and rotates to the electrical cabinet for service. For more information on the process, please see www.esi.com.

Technical Specifications

Component	Specifications
ENVIRONMENT:	Class 100,000..
REPEATABILITY:	/-1 micron beam placement, /-1 micron laser focus.
KEY ATTRIBUTES:	Customizable with various industry standard probers and test interfaces. Ergonomic and aesthetic design. DSP-based control. Galvo controller improvements. Servo-laser focus control. Kinematic optics bench. Vibration Isolation. Passive thermal cooling optics environment. CE compliant.
INTEGRATED TECHNICAL CAPABILITIES:	Integrated Motion Control Clean Room Machines Precision Positioning and Alignment PC Controls Wafer Handling

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