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Precision Adhesive Dispensing Machine

Precision Adhesive Dispensing Machine

Apply Three (3) Micro-Dots Per Second With 25-Micron Accuracy.

This system applies adhesive onto a substrate at a very high rate of speed and with micron-level precision. This sophisticated process tool uses high performance machine vision and precision motion control to apply small glue dots (300-micron diameter) to the surface of a wafer.

Wafers are loaded via cassette or single station, then placed on the X-Y stage using a Brooks/PRI wafer handling robot. An integral vision system dynamically inspects dot size and location during the process.

Technical Specifications

Component Specifications
HANDLING ROBOT:

Equipe/PRI Automation.

CONTROL SYSTEM:

Windows NT™ with RTX real time extension; custom control program in C ™.

OPERATOR INTERFACE:

Custom multi-screen operator interface written in C ™.

WAFER TRACKING:

Cognex® OCR system to read wafer serial number.

SERVO CONTROL:

Galil® four-axis motion control.

ENVIRONMENT:

Class 10,000 clean room.

DISCRETE I/O:

Approximately 144 I/O points.

THROUGHPUT:

Three dots/second.

VISION SYSTEM:

Cognex® with Melles Griot optics.

ACCURACY:

± 25-micron placement accuracy.

KEY ATTRIBUTES:

High speed, high precision glue dispensing with vision inspection. Inspection data written to a log associated with the wafer.

INTEGRATED TECHNICAL CAPABILITIES:
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