Precision Adhesive Dispensing Machine

Apply Three (3) Micro-Dots Per Second With 25-Micron Accuracy.

This system applies adhesive onto a substrate at a very high rate of speed and with micron-level precision. This sophisticated process tool uses high performance machine vision and precision motion control to apply small glue dots (300-micron diameter) to the surface of a wafer.

Wafers are loaded via cassette or single station, then placed on the X-Y stage using a Brooks/PRI wafer handling robot. An integral vision system dynamically inspects dot size and location during the process.

Project Brochure

Technical Specifications

Component	Specifications
HANDLING ROBOT:	Equipe/PRI Automation.
CONTROL SYSTEM:	Windows NT™ with RTX real time extension; custom control program in C ™.
OPERATOR INTERFACE:	Custom multi-screen operator interface written in C ™.
WAFER TRACKING:	Cognex® OCR system to read wafer serial number.
SERVO CONTROL:	Galil® four-axis motion control.
ENVIRONMENT:	Class 10,000 clean room.
DISCRETE I/O:	Approximately 144 I/O points.
THROUGHPUT:	Three dots/second.
VISION SYSTEM:	Cognex® with Melles Griot optics.
ACCURACY:	± 25-micron placement accuracy.
KEY ATTRIBUTES:	High speed, high precision glue dispensing with vision inspection. Inspection data written to a log associated with the wafer.
INTEGRATED TECHNICAL CAPABILITIES:	Wafer Handling Machine Vision – High Performance and Low Cost Integrated Motion Control Precision Dispensing Precision Positioning and Alignment PC Controls

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